Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding

Authors
Citation
Y. Zhou, Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding, J MAT SCI L, 20(9), 2001, pp. 841-844
Citations number
15
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
0261-8028 → ACNP
Volume
20
Issue
9
Year of publication
2001
Pages
841 - 844
Database
ISI
SICI code
0261-8028(2001)20:9<841:AMOISD>2.0.ZU;2-9