Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene)

Citation
Wh. Lee et al., Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene), J VAC SCI A, 19(6), 2001, pp. 2974-2978
Citations number
25
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
ISSN journal
0734-2101 → ACNP
Volume
19
Issue
6
Year of publication
2001
Pages
2974 - 2978
Database
ISI
SICI code
0734-2101(200111/12)19:6<2974:CVDOAE>2.0.ZU;2-B