Heterogeneous materials integration: compliant substrates to active deviceand materials packaging

Citation
As. Brown et al., Heterogeneous materials integration: compliant substrates to active deviceand materials packaging, MAT SCI E B, 87(3), 2001, pp. 317-322
Citations number
41
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
ISSN journal
0921-5107 → ACNP
Volume
87
Issue
3
Year of publication
2001
Pages
317 - 322
Database
ISI
SICI code
0921-5107(200112)87:3<317:HMICST>2.0.ZU;2-W
Abstract
The drive for the heterogeneous integration of materials has led to signifi cant advances in materials and device processing, and in the understanding of defect production and control during epitaxy. Heterogeneous integration is driven by microelectronic and packaging trends, and the advent of new ma terials, such as GaN, that do not possess native substrates. During the las t decade, these objectives led to research in the development of compliant substrates. While the ideal compliant substrate concept and implementation may be flawed, this research has certainly advanced materials integration t echnology. This paper will provide an overview of recent results in complia nt substrate experiments and interpretation, and the related advancement of materials and device integration and packaging deriving from some of this research. (C) 2001 Published by Elsevier Science B.V.