Tribological evaluation of carbon coatings with and without nitrogen incorporation applicable to MicroElectroMechanical systems

Authors
Citation
Df. Wang et K. Kato, Tribological evaluation of carbon coatings with and without nitrogen incorporation applicable to MicroElectroMechanical systems, SENS ACTU-A, 93(3), 2001, pp. 251-257
Citations number
31
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Instrumentation & Measurement
Journal title
SENSORS AND ACTUATORS A-PHYSICAL
ISSN journal
0924-4247 → ACNP
Volume
93
Issue
3
Year of publication
2001
Pages
251 - 257
Database
ISI
SICI code
0924-4247(20011015)93:3<251:TEOCCW>2.0.ZU;2-C
Abstract
Although the integration into macro-devices and systems is a promising appl ication, a MicroElectroMechanical system (MEMS) will become much more usefu l when it can be driven by a connected microactuator of small size, low-pow er and low-mass, and then controlled precisely at desired operation conditi ons. Recent demonstration of silicon material-based microactuator has revea led a profound influence of friction and wear on the whole performance incl uding increased functioning, reliability, robustness, long life and high sa fety. Since undesirable tribological contacts occur directly between moving parts or moving and fixed ones and indirectly due to generated wear partic les or dust particles interfering with tight tolerance, thin hard protectiv e coatings, as an effective solution, which can be expected to reduce the f riction and improve the wear resistance of silicon materials, need to be ex ploited. With the expected protective sputter-coatings of carbon with and without ni trogen incorporation, this work has been focused on the wear resistance imp rovement enhanced by nitrogen incorporation dynamically and initially evalu ated from the view point of "wear particle generation", in comparison to si licon materials for the possible use in MEMS. A discussion is also given in to a new access to tribological evaluation of protective coatings applicabl e to MEMS. (C) 2001 Elsevier Science B.V. All rights reserved.