Effect of stress ratio on fatigue crack growth in 95Pb-5Sn solder

Citation
J. Zhao et al., Effect of stress ratio on fatigue crack growth in 95Pb-5Sn solder, J ELEC PACK, 123(3), 2001, pp. 311-315
Citations number
24
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
1043-7398 → ACNP
Volume
123
Issue
3
Year of publication
2001
Pages
311 - 315
Database
ISI
SICI code
1043-7398(200109)123:3<311:EOSROF>2.0.ZU;2-X
Abstract
The stress ratio effect on the fatigue crack growth behavior of 95Pb-5Sn so lder has been investigated. It is found that both DeltaJ and AK can correla te fatigue crack growth data well, which means that the crack growth behavi or of the 95Pb-5Sn solder under the frequency, of 10 Hz was dominantly cycl ic dependent. The da/dN-DeltaJ relationship can be expressed as: da/dN=1.1 x 10(-11). DeltaJ(1.45). Low level of crack closure was found only in the n ear-threshold region. Except in this region, no crack closure was observed in the present test conditions. Both transgranular and intergranular fractu res were observed on fracture surfaces: the former was dominant in most tes t conditions and the latter was dominant at the high stress ratio of 0.7. S triations and striation-like features were also found. Many slip bands and cavities along the grain boundary were observed on the crack wake and ahead of the crack tip in the high crack growth rate region.