Thermal interface pastes based on silicone, lithium doped polyethylene glyc
ol (PEG), and sodium silicate were evaluated in their performance before an
d after heating tip to 120 degreesC. The thermal contact conductance of any
of the pastes between copper disks decreased after heating, such that the
fractional decrease was less for the silicone-based paste than the PEG-base
d and sodium-silicate-based pastes. Nevertheless, the conductance was lower
for the silicone-based paste than the other pastes both before and after h
eating up to 100 cycles.