Thermal stability of thermal interface pastes, evaluated by thermal contact conductance measurement

Citation
Xc. Luo et al., Thermal stability of thermal interface pastes, evaluated by thermal contact conductance measurement, J ELEC PACK, 123(3), 2001, pp. 309-311
Citations number
8
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
1043-7398 → ACNP
Volume
123
Issue
3
Year of publication
2001
Pages
309 - 311
Database
ISI
SICI code
1043-7398(200109)123:3<309:TSOTIP>2.0.ZU;2-C
Abstract
Thermal interface pastes based on silicone, lithium doped polyethylene glyc ol (PEG), and sodium silicate were evaluated in their performance before an d after heating tip to 120 degreesC. The thermal contact conductance of any of the pastes between copper disks decreased after heating, such that the fractional decrease was less for the silicone-based paste than the PEG-base d and sodium-silicate-based pastes. Nevertheless, the conductance was lower for the silicone-based paste than the other pastes both before and after h eating up to 100 cycles.