Temperature distribution in advanced power electronics systems and the effect of phase change materials on temperature suppression during power pulses

Citation
Ag. Evans et al., Temperature distribution in advanced power electronics systems and the effect of phase change materials on temperature suppression during power pulses, J ELEC PACK, 123(3), 2001, pp. 211-217
Citations number
13
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
1043-7398 → ACNP
Volume
123
Issue
3
Year of publication
2001
Pages
211 - 217
Database
ISI
SICI code
1043-7398(200109)123:3<211:TDIAPE>2.0.ZU;2-4
Abstract
A thermal analysis has been performed for a package design pertinent to pow er electronics. The objective has been the derivation of straightforward ex pressions that relate the materials used and their physical dimensions to t he power input and the junction temperature. This has been done for both st eady-state operating conditions and for pulses. The role of phase change ma terials (PCMs) in suppressing temperature elevations during pulses is also addressed.