Laser ablation of Si under a water surface has been investigated. The laser
used is a KrF excimer laser, which has a wavelength of 248 nm and a pulse
duration of 23 ns. It is found that the laser ablation rate of Si varies wi
th the thickness of the water layer above the Si substrates. The laser abla
tion rate is the most highly enhanced with a water layer of 1.1 mm. It is a
ssumed that the plasma generated in the water confinement regime with an op
timal water layer thickness induces the strongest pressure. This high-press
ure, high-temperature plasma results in the highest ablation rate. A wide-b
and microphone is used to detect the audible acoustic wave generated during
the laser ablation. The amplitude of the acoustic wave is closely related
to the ablation rate. It is found that the first peak-to-peak amplitude of
the acoustic wave is the strongest when the water layer thickness is 1.1 mm
above the substrate. Fast Fourier transform analysis of the wave forms sho
ws that there are several frequency components included in the acoustic wav
es. The dominant frequency component decreases from 10.6 to 3.5 kHz as the
water layer thickness varies from 1 to 2.2 mm. Diagnostics of the acoustic
wave emission can be used to find the optimal water layer thickness to enha
nce the laser ablation rate. With proper calibration, acoustic-wave detecti
on can be used as a real-time monitoring of the laser ablation. (C) 2001 Am
erican Institute of Physics.