Fluxless wetting properties of top surface metallurgy in different Pb-freesolders

Citation
Sm. Hong et al., Fluxless wetting properties of top surface metallurgy in different Pb-freesolders, MATER TRANS, 42(7), 2001, pp. 1423-1427
Citations number
12
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Material Science & Engineering
Journal title
MATERIALS TRANSACTIONS
ISSN journal
1345-9678 → ACNP
Volume
42
Issue
7
Year of publication
2001
Pages
1423 - 1427
Database
ISI
SICI code
1345-9678(200107)42:7<1423:FWPOTS>2.0.ZU;2-7
Abstract
The fluxless wetting properties were evaluated for TSM ((T) under bar op (S ) under bar urface (M) under bar etallurgy)-coated glass substrate by wetti ng balance method. The wettability of TSM was estimated with new indices fr om the wetting curve for one side-coated specimen. For TSM, it was more eff ective to use Cu as a wetting layer with Au as a protection layer than to u se Au as a wetting layer alone. The degree of wetting of Sn-5Sb and Sn-57Bi solder was better than that of Sn-37Pb and Sn-3.5Ag solder. However, the w etting rate of Sn-37Pb solder was higher than those of Pb-free solders. The wetting angle of TSM-coated glass substrate to solders could be calculated from the force balance equation by measuring static state force and tilt a ngle. The wetting angles of Cr/Cu/Au TSM to Sn-37Pb, Sn-3.5Ag, Sn-5Sb and S n-57Bi were 69.4 degrees, 67.2 degrees 60.1 degrees and 53.0 degrees, respe ctively.