Measurement of thermal expansion coefficient of flexible substrate by moire interferometry

Authors
Citation
B. Han et al., Measurement of thermal expansion coefficient of flexible substrate by moire interferometry, EXP TECH, 25(3), 2001, pp. 22-25
Citations number
10
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Mechanical Engineering
Journal title
EXPERIMENTAL TECHNIQUES
ISSN journal
0732-8818 → ACNP
Volume
25
Issue
3
Year of publication
2001
Pages
22 - 25
Database
ISI
SICI code
0732-8818(200105/06)25:3<22:MOTECO>2.0.ZU;2-F