Micro heat flux sensor using copper electroplating in SU-8 microstructures

Citation
Sh. Oh et al., Micro heat flux sensor using copper electroplating in SU-8 microstructures, J MICROM M, 11(3), 2001, pp. 221-225
Citations number
11
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
ISSN journal
0960-1317 → ACNP
Volume
11
Issue
3
Year of publication
2001
Pages
221 - 225
Database
ISI
SICI code
0960-1317(200105)11:3<221:MHFSUC>2.0.ZU;2-1
Abstract
A micro heat flux sensor which can measure the thermal energy transfer per unit area has been designed, fabricated, and calibrated in a convective env ironment. The sensor which is based on a circular foil gage is composed of thermal paths and a thermopile. The thermal path is made in a LIGA-like pro cess of SU-8 high aspect ratio microstructures and electroplated copper lay ers. The thermopile, a series of thermocouples, is used to amplify the outp ut signal as a thermometer. When the sensor is placed on a high-temperature wall, heat flux from the wall flows through thermal paths and drains out t o the environment, producing a temperature difference along its paths. Heat flux is obtained by calibrating this temperature difference in the thermop ile of Ni-Cr or Al-Chromel pairs. The sensitivity of the heat flux sensor o f Ni-Cr and Al-Chromel pairs is in the range of 0.1-2.0 and 0.4-2.0 muV mW( -1) cm(-2), respectively, in the heat flux range of 0-180 mW cm(-2).