Palladium thin film deposition on polyimide by CWAr+ laser radiation for electroless copper plating

Citation
K. Kordas et al., Palladium thin film deposition on polyimide by CWAr+ laser radiation for electroless copper plating, THIN SOL FI, 384(2), 2001, pp. 185-188
Citations number
28
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
0040-6090 → ACNP
Volume
384
Issue
2
Year of publication
2001
Pages
185 - 188
Database
ISI
SICI code
0040-6090(20010315)384:2<185:PTFDOP>2.0.ZU;2-R
Abstract
Ar+ laser radiation (CW, 488 nm) is used to induce deposition of palladium (Pd) thin films onto polyimide surfaces from palladium-amine {[Pd(NH3)(4)]( 2+)} solutions. The chemical reaction is carried out by formaldehyde-assist ed reduction of palladium-amine complex molecules to metallic Pd, and is lo calized on the polymer substrate by a focused and scanned Arf laser beam. T he narrow (6-14 mum), homogeneous and thin (< 50 nm) palladium patterns are found to be excellent catalysts for further copper autocatalytic electrole ss deposition. Both the Pd and Cu layers are characterized by scanning elec tron microscopy (equipped with EDAX), a DEKTAK profiler and resistivity mea surements. (C) 2001 Elsevier Science B.V. All rights reserved.