Bonding of silicon nitride ceramics using Fe-Ni/Cu/Ni/Cu/Fe-Ni interlayers

Citation
F. Fang et al., Bonding of silicon nitride ceramics using Fe-Ni/Cu/Ni/Cu/Fe-Ni interlayers, MATER LETT, 47(3), 2001, pp. 178-181
Citations number
9
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS LETTERS
ISSN journal
0167-577X → ACNP
Volume
47
Issue
3
Year of publication
2001
Pages
178 - 181
Database
ISI
SICI code
0167-577X(200101)47:3<178:BOSNCU>2.0.ZU;2-O
Abstract
The joints of Si3N4 ceramics bonded together with Fe-Ni/Cu/Ni/Cu/Fe-Ni inte rlayers were compared with the joints bonded with Ti/Cu/Ni/Cu/Ti interlayer s. The composition and the strength of eight kinds of joints were studied u sing scanning electron microscopy (SEM), electron probe microanalysis (EPMA ). X-ray diffraction (XRD) and strength tests. It was found that the Fe-Ni interlayers formed constantly strong joints with interfaces that were strai ght with no distinguishable reaction layers. (C) 2001 Elsevier Science B.V. All rights reserved.