Edge effects in thin film delamination

Hh. Yu et al., Edge effects in thin film delamination, ACT MATER, 49(1), 2001, pp. 93-107
Citations number
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
ISSN journal
1359-6454 → ACNP
Year of publication
93 - 107
SICI code
Thin films bonded to a substrate often sustain large in-plane residual stre sses that are transferred to the film via shear stresses on the interface n ear their edges. These edge zones play a significant role in film delaminat ion. A new method is introduced to analyze both the residual stress distrib ution in a film near its edge and the energy release rate and mode mix for an interface delamination crack emerging from, or converging upon, an edge. Two two-dimensional configurations are considered: (a) a film whose edge l ies in the interior of the substrate and (b) a film whose edge is aligned w ith the edge of the substrate (i.e. the film/substrate geometry is a quarte r-plane). There are significant differences between the two cases. For the former, (a), the energy release rate approaches the steady-state, limiting rate for a long interface crack when the crack has extended less than one f ilm thickness. By contrast, the energy release rate in case (b) remains far below the steady-state rate until the crack extends to ten or more film th icknesses from the edge. In case (b), the edge effect provides a significan t protection against edge delamination, whereas in case (a) it does not. El astic mismatch between the film and the substrate is significant in case (b ), but not in case (a). A second set of behaviors is investigated wherein t he interface crack approaches the edge of the film from the interior. For b oth types of edges, the energy release rate drops well below the steady-sta te rate at remaining ligament lengths that are very large compared to the f ilm thickness, approaching zero as the delamination converges on the edge. Analytic features which account for the various behaviors will be highlight ed, and practical implications for thin film delamination will be discussed . (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All righ ts reserved.