Fabrication of a fully integrated passive module for filter application using MCM-D compatible processes

Citation
Sk. Bhattacharya et al., Fabrication of a fully integrated passive module for filter application using MCM-D compatible processes, J MAT S-M E, 11(6), 2000, pp. 455-460
Citations number
18
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN journal
0957-4522 → ACNP
Volume
11
Issue
6
Year of publication
2000
Pages
455 - 460
Database
ISI
SICI code
0957-4522(200008)11:6<455:FOAFIP>2.0.ZU;2-P
Abstract
Integral passive is an emerging technology which is currently perceived as a possible alternative to the discrete passive technology in fulfilling the next generation packaging needs. Although discrete surface mount passive c omponents (resistors, capacitors, and inductors) have been well characteriz ed, the development of integral passive components suitable for co-integrat ion on the board level is relatively recent. Since in some applications the number of passive components can exceed the number and the area of IC chip s on a circuit board or in a package, such integration of passive component s would be necessary to substantially eliminate part count and reduce devic e area. To address these issues, integration technology for passive element s in the same manner as for transistors is necessary. In addition, the fabr ication sequence of all integral passive components should be mutually comp atible for co-integration on the same substrate. In this paper, materials a nd fabrication issues for passive elements such as resistors (R), capacitor s (C), and inductors (L) and the feasibility of integration of these fabric ated passive components on glass substrates have been addressed. An active filter circuit has been selected for a case study for R, L, and C co-integr ation. This passive module contains eleven resistors, four capacitors, and four inductors, and is fabricated using MCM-D (multichip module-deposited) compatible processes. A variety of materials appropriate for fabrication of integral passives in a mutually compatible fashion were investigated, incl uding chromium and nickel-chromium resistors, composites of high dielectric constant materials in epoxies for capacitor dielectrics, and composites of magnetic ferrite particles in polyimides for inductor core and shielding. The fabricated devices showed good agreement between the design values and the corresponding measured values. It is anticipated that some of these mat erials and fabrication processes can be implemented for the MCM-L (multichi p module-laminate) compatible packaging. (C) 2000 Kluwer Academic Publisher s.