The first bump-bonded pixel detectors on CVD diamond

Citation
W. Adam et al., The first bump-bonded pixel detectors on CVD diamond, NUCL INST A, 436(3), 1999, pp. 326-335
Citations number
11
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences","Instrumentation & Measurement
Journal title
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT
ISSN journal
0168-9002 → ACNP
Volume
436
Issue
3
Year of publication
1999
Pages
326 - 335
Database
ISI
SICI code
0168-9002(19991101)436:3<326:TFBPDO>2.0.ZU;2-N
Abstract
Diamond is a nearly ideal material for detecting ionising radiation. Its ou tstanding radiation hardness, fast charge collection and low leakage curren t allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding This effort resulted in an ope rational diamond pixel sensor that was tested in a pion beam. We demonstrat e that greater than 98% of the channels were successfully bump-bonded and f unctioning. The device shows good overall hit efficiency as well as clear s patial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 mu m was observed, consistent with expectati ons given the detector pitch. (C) 1999 Elsevier Science B.V. All rights res erved.