Effect of aging temperature and microstructure on mechanical properties ofCu-9Ni-6Sn alloy

Citation
Yc. Jung et al., Effect of aging temperature and microstructure on mechanical properties ofCu-9Ni-6Sn alloy, J JPN METAL, 63(10), 1999, pp. 1338-1347
Citations number
23
Language
GIAPPONESE
art.tipo
Article
Categorie Soggetti
Metallurgy
Journal title
JOURNAL OF THE JAPAN INSTITUTE OF METALS
ISSN journal
0021-4876 → ACNP
Volume
63
Issue
10
Year of publication
1999
Pages
1338 - 1347
Database
ISI
SICI code
0021-4876(199910)63:10<1338:EOATAM>2.0.ZU;2-C
Abstract
The effects of aging temperature and microstructure on the mechanical and p hysical properties of a Cu-9Ni-6Sn(mass%) alloy were investigated and the f ollowing results were obtained. The mechanical and physical properties such as tensile strength, elongation and electrical resistivity of the Cu-9Ni-6 Sn alloy were strongly dependent on the aging temperature, aging time and m icrostructures. This alloy was much strengthened by aging at temperatures b elow 673 K where the spinodal decomposition occurs, but the specimen is not strengthened by aging at temperatures above 673 K where the discontinuous precipitate forms. The electrical resistivity was decreased by aging and th e degree of reduction increased with increasing aging temperature and time. These results obtained in the present study indicate that the strengthenin g mechanisms of the Cu-9Ni-6Sn alloy are changed by the aging conditions.