The effects of aging temperature and microstructure on the mechanical and p
hysical properties of a Cu-9Ni-6Sn(mass%) alloy were investigated and the f
ollowing results were obtained. The mechanical and physical properties such
as tensile strength, elongation and electrical resistivity of the Cu-9Ni-6
Sn alloy were strongly dependent on the aging temperature, aging time and m
icrostructures. This alloy was much strengthened by aging at temperatures b
elow 673 K where the spinodal decomposition occurs, but the specimen is not
strengthened by aging at temperatures above 673 K where the discontinuous
precipitate forms. The electrical resistivity was decreased by aging and th
e degree of reduction increased with increasing aging temperature and time.
These results obtained in the present study indicate that the strengthenin
g mechanisms of the Cu-9Ni-6Sn alloy are changed by the aging conditions.