Interfacial reactions of tin-zinc-bismuth alloys

Authors
Citation
P. Harris, Interfacial reactions of tin-zinc-bismuth alloys, SOLDER S MT, 11(3), 1999, pp. 46-52
Citations number
15
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLDERING & SURFACE MOUNT TECHNOLOGY
ISSN journal
0954-0911 → ACNP
Volume
11
Issue
3
Year of publication
1999
Pages
46 - 52
Database
ISI
SICI code
0954-0911(1999)11:3<46:IROTA>2.0.ZU;2-Y
Abstract
A variety of lead-free solders are now commercially available. Of those sui table for mass soldering perhaps the ones closest to a direct, drop-in, rep lacement for tin-lead are the tin-zinc-bismuth alloys. For mosi tin-based s olders it is the tin which is the active element and dominates the all-impo rtant interfacial reactions. As a result they have many properties in commo n. The addition of zinc, however, radically alters this picture. Zinc oxida tion products are formed at the surfaces. Zinc intermetallic compounds are also formed in preference to tin-compounds at the substrate interfaces. The nature and implications of these changes are outlined for the common basis materials.