Enhancing IC repairs by combining laser direct-writing of Cu and FIB techniques

Citation
J. Remes et al., Enhancing IC repairs by combining laser direct-writing of Cu and FIB techniques, MICROEL REL, 39(6-7), 1999, pp. 997-1001
Citations number
9
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
0026-2714 → ACNP
Volume
39
Issue
6-7
Year of publication
1999
Pages
997 - 1001
Database
ISI
SICI code
0026-2714(199906/07)39:6-7<997:EIRBCL>2.0.ZU;2-4
Abstract
The aim of this work was to demonstrate the combination of laser direct-wri ting of Cu and FIB techniques. Preliminary electrical resistivity measureme nts and a comparison between the pros and cons of both methods have been ca rried out. Some IC repair cases are presented where an FIB device has been used in combination with the laser deposition device developed in the micro electronics laboratory. Also, particular attention has been given to proble ms which are insoluble by the FIB technique but readily resolved by the las er system. (C) 1999 Elsevier Science Ltd. All rights reserved.