The aim of this work was to demonstrate the combination of laser direct-wri
ting of Cu and FIB techniques. Preliminary electrical resistivity measureme
nts and a comparison between the pros and cons of both methods have been ca
rried out. Some IC repair cases are presented where an FIB device has been
used in combination with the laser deposition device developed in the micro
electronics laboratory. Also, particular attention has been given to proble
ms which are insoluble by the FIB technique but readily resolved by the las
er system. (C) 1999 Elsevier Science Ltd. All rights reserved.