Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant

Citation
Yh. Xu et al., Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant, APPL PHYS L, 75(6), 1999, pp. 853-855
Citations number
20
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
0003-6951 → ACNP
Volume
75
Issue
6
Year of publication
1999
Pages
853 - 855
Database
ISI
SICI code
0003-6951(19990809)75:6<853:DPAMOA>2.0.ZU;2-T
Abstract
This letter reports the synthesis and dielectric properties of a porous pol y(arylethers) material with an ultralow dielectric constant for interlayer dielectric applications in microelectronics. The porous polymer films were fabricated by a method of organic phase separation and evaporation. A diele ctric constant of 1.8 was achieved for a porous film with an estimated poro sity of 40%. The characterization of microstucture for the porous film show ed numerous nanopores with an average size of 3 nm distributed uniformly th roughout the film. (C) 1999 American Institute of Physics. [S0003-6951(99)0 1832-X].