The effect of energetic ion bombardment during growth on the interface structure of Co Cu multilayers

Citation
Nd. Telling et al., The effect of energetic ion bombardment during growth on the interface structure of Co Cu multilayers, J MAGN MAGN, 199, 1999, pp. 713-715
Citations number
9
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
ISSN journal
0304-8853 → ACNP
Volume
199
Year of publication
1999
Pages
713 - 715
Database
ISI
SICI code
0304-8853(199906)199:<713:TEOEIB>2.0.ZU;2-3
Abstract
A modified unbalanced magnetron sputtering technique was applied to the gro wth of multilayer Co/Cu films in order to systematically study the interfac e structure evolved under ion bombardment. X-ray reflectivity measurements revealed an interface smoothing effect in samples deposited under similar t o 200 eV ion bombardment. A reduction in the Bragg peak intensity for sampl es with a greater number of bilayer repeats was also observed. This was att ributed to roughening of the final surface in the thicker films. (C) 1999 E lsevier Science B.V. All rights reserved.