MICROSTRUCTURE AT INTERFACE OF STEEL ALUM INUM BONDING SHEET AND FORMATION OF INTERMETALLIC COMPOUND/

Citation
H. Oikawa et al., MICROSTRUCTURE AT INTERFACE OF STEEL ALUM INUM BONDING SHEET AND FORMATION OF INTERMETALLIC COMPOUND/, Tetsu to hagane, 84(1), 1998, pp. 73-78
Citations number
NO
Language
GIAPPONESE
art.tipo
Article
Categorie Soggetti
Metallurgy & Metallurigical Engineering
Journal title
ISSN journal
0021-1575
Volume
84
Issue
1
Year of publication
1998
Pages
73 - 78
Database
ISI
SICI code
0021-1575(1998)84:1<73:MAIOSA>2.0.ZU;2-K
Abstract
This paper deals with the relation between the microstructure and the formation of intermetallic compound(IMC) at the interfaces of the bond ing sheets. The bonding sheets, steel/aluminum alloy(CS/A5) and stainl ess steel/pure aluminum (SS/Al), were produced by hot rolling. From th e results of TEM observation, it was found that aluminum or chromium o xide films were existed and the IMC were formed locally at the interfa ces of the bonding sheets. Two or three types of the IMC composed of c olumnar structure were formed at the interfaces of the bonding sheets after heating. The oxide films remained at the IMC/aluminum interfaces of the CS/A5 bonding sheets. The specific crystallographic orientatio n relationship was recognized at the SS/IMC interfaces of the SS/Al bo nding sheets. It was considered that the formation of the IMC were gre atly effected by the oxide films existed at the interfaces of the bond ing sheets.