M. Yanaka et al., CRACKING PHENOMENA OF BRITTLE FILMS IN NANOSTRUCTURE COMPOSITES ANALYZED BY A MODIFIED SHEAR LAG MODEL WITH RESIDUAL STRAIN, Journal of Materials Science, 33(8), 1998, pp. 2111-2119
This paper proposes a modification to the shear lag model for multiple
cracking of thin films in order to take into account the residual str
ain, and uses it to estimate the critical fracture strength of SiOx fi
lms with thicknesses from 75 to 660 nm deposited on 12 thick polyethyl
ene terephthalate (PET) substrates. It was found that: (1) The differe
nce of residual strains in the film and substrate increased as the thi
ckness of the film decreased. (2) In both initial and multiple formati
on of cracks, SiOx films failed at almost constant values of a critica
l stress ranging from 200 to 300 MPa when the thickness was larger tha
n 200 nm, whereas below that it failed at higher values. (C) 1998 Chap
man & Hall.