MONITORING OF THE CURING AND PROCESS-INDUCED DEFORMATION OF COMPOSITE-MATERIALS BY DIELECTROMETRY

Citation
Em. Gutman et al., MONITORING OF THE CURING AND PROCESS-INDUCED DEFORMATION OF COMPOSITE-MATERIALS BY DIELECTROMETRY, Journal of materials science letters, 13(9), 1994, pp. 633-635
Citations number
6
Language
INGLESE
art.tipo
Article
Categorie Soggetti
Material Science
ISSN journal
0261-8028
Volume
13
Issue
9
Year of publication
1994
Pages
633 - 635
Database
ISI
SICI code
0261-8028(1994)13:9<633:MOTCAP>2.0.ZU;2-J