Results: 1-4 |
Results: 4

Authors: Hizukuri, M Watanabe, N Asano, T
Citation: M. Hizukuri et al., Dynamic strain and chip damage during ultrasonic flip chip bonding, JPN J A P 1, 40(4B), 2001, pp. 3044-3048

Authors: Hizukuri, M Asano, T
Citation: M. Hizukuri et T. Asano, Measurement of dynamic strain during ultrasonic Au bump formation on Si chip, JPN J A P 1, 39(4B), 2000, pp. 2478-2482

Authors: Baba, A Hizukuri, M Iwamoto, M Asano, T
Citation: A. Baba et al., Stamp technology for fabrication of field emitter from organic material, J VAC SCI B, 18(2), 2000, pp. 877-879

Authors: Baba, A Hizukuri, M Iwamoto, M Asano, T
Citation: A. Baba et al., Fabrication of carbon-based field emitters using stamp technology, JPN J A P 1, 38(12B), 1999, pp. 7203-7207
Risultati: 1-4 |